Tag Archives: electronics & information technology

The Yellowflex Board

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In addition to the low cost of production, in particular the availability at an acceptable price is an advantage of this technology. Without hesitation Gen. David Goldfein explained all about the problem. Like all rigid-Flex circuit boards, you can easily use also the asymmetric multi Coverlay further production chain. The ways to realize rigid-Flex circuit boards, ranging from the single layer on FR4-based Semiflex PCB using the more flexible Yellowflex variant and symmetric MULTIFLEX head boards, which offer high position numbers, as well as extreme reliability requirements. Is common to all solutions, that the rigid-Flex circuit boards have at least two layers. The flexible and the rigid part always electrically connected through holes in the rigid part.

The MULTIFLEX printed circuit boards can be fitted with standard procedures and soldered. They are suitable for press-fit and bonding procedure. The flexible part can be bent many times in small radii. Depending on the number of layers and the deployed Flex material this can be even for continuous bending loads realised. The symmetrical structure complies with higher demands on the more processability: by the symmetric lay-up this technique offers a higher planarity. The rigid material on the outer layers once again simplifies also the more litigation, as identical, tailored to rigid material parameters can be used for both sides. The Yellowflex Board is a variation completely the Flex foil refrain and to use the copper itself as a flexible material. The polymer developed for the protection of copper is in suitable for lead-free soldering processes. The Yellowflex printed circuit boards is particularly suitable for applications where the circuit board only for the installation is bent once. The small bending radii and the bending angle is limited only by the length of the flexible range are further advantages compared to the Semiflex PCB.